Foldable flex and thinned silicon multichip packaging technology

Cover of: Foldable flex and thinned silicon multichip packaging technology |

Published by Kluwer Academic Publishers in Boston .

Written in English

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Subjects:

  • Microelectronic packaging,
  • Multichip modules (Microelectronics),
  • Chip scale packaging,
  • Flexible printed circuits

Edition Notes

Book details

Statementedited by John W. Balde.
SeriesEmerging technology in advanced packaging series -- 1.
ContributionsBalde, John W., 1923-
Classifications
LC ClassificationsTK7870.15 .F65 2003, TK7870.15 .F65 2003
The Physical Object
Paginationxix, 338 p. :
Number of Pages338
ID Numbers
Open LibraryOL18183504M
ISBN 100792376765
LC Control Number2002034095

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called /2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner. Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called /2 D technology.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called /2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).2/5(1).

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Foldable Flex and Thinned Silicon Chips for Multichip Packaging. presents one of the latest developments in the microelectronics packaging methods using foldable flexible circuits and thinned silicon chips.

The book is written by a number of the well-known individuals in the field and edited by John Balde. Chapter 8 describes a patented Cited by: 2.

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DOI: /TEPM Corpus ID: Flip Chip Assembly of Thinned Silicon Die on Flex Substrates @article{BandaFlipCA, title={Flip Chip Assembly of Thinned Silicon Die on Flex Substrates}, author={Chikosa Ulendo Banda and R.

Wayne Johnson and Tan Zhang and Zhenwei Hou and H Charles}, journal={IEEE Transactions on Electronics Packaging Manufacturing}, year={}. Book review Full text access Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December Hardbound, pp., Number of figures and tablesEURO /USD /GBPISBN Foldable Flex and Thinned Silicon Chips for Multichip Packaging EXFO Lite Ultraviolet/Visible Spot Curing System is released New high power thick film SMT.

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